The ideal candidate will have a BS in Electrical Engineering or Materials Engineering or an Associate's degree with several years of job experience as a Physical Failure Analysis Engineer.
Previous experience of physical failure analysis techniques including package and die de-processing, microscopy, SEM, is strongly preferred.
Responsible for identifying failures and researching process/Product improvements to enhance yield, performance, quality and reliability of next generation Si, Product and Package technologies.
Investigates and thoroughly explains fundamental aspects of material/device interactions. Owns the development of electrical, analytical and mechanical methodologies to ensure strategic failure analysis capabilities for future technologies and products.
Directs new technology/product transfer, manufacturing startup, and the automation and improvement of the failure analysis process. Owns proliferation of shared learning across sites. Maintains necessary records and reports. Performs other related duties as required or as directed.
Inside this Business Group
You will use your strong problem solving skills and knowledge of circuits and fab processes to hypothesize then validate failure causes.
Knowledge of fault isolation techniques such as IREM, LADA, TIVA will benefit both you and the team.
Direct knowledge of Intel FINFET physical failure analysis methods will position you to be a bridge between external and internal fab process technologies.
Your and the team's conclusions will direct business decisions. As such, you will rely on your strong organization skills, attention to detail, and communication skills [both written and oral].
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth