This is a thermal engineering position in the Client Computing Group, CCG. Our group develops thermal / mechanical enabling solutions to support the Client Silicon Roadmap.
The thermal / mechanical solutions take the form of system design guides, system guidance, thermal power system management, and heat sink designs.
The principal responsibility of this position is to apply and communicate predictive thermal methods/results as a collaborating member of a multi-disciplinary product development team. Additionally, the successful candidate may be responsible for development of innovative thermal solutions.
The ideal candidate should exhibit the following behavior skills:-Strong verbal and written communication skills.
Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position.
Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
- Must have a Master's or Ph.D. in Mechanical Engineering or related field.
- Minimum of 9 months experience with Thermal Management
-Industry experience through internships.
The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.