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Job ID: JR0009431
Job Category: Engineering
Primary Location: Bangalore, KA IN
Other Locations:
Job Type: College Grad

Product Design Engineer

Job Description
In this position, you will be responsible for executing package designs across Intel's product portfolios CPUs, Chipsets, SOC designs and more as part of the Assembly and Test Technology Development group. The job will require the candidate to Understand packaging technology development FMEAs and product packaging requirements - both physical and electrical. You will be directing technical aspects of the Package design process including conducting early route studies, creation of specifications, providing guidance for electrical analysis and supervision of production layouts. Job function also involves managing design schedules, conducting design reviews and guide in package tape out process. As Package design engineer, the successful candidate will also work closely with other stakeholders from different organizations within the company to incorporate their inputs into the package design. The job scope also includes post design validation data analysis to understand the packaging impact to product performance, yield and reliability. The candidate would need to have the ability to learn and adapt to multiple CAD tools and other design software applications and develop robust and optimal design solutions through CAD layout using package design tools that meet all stakeholder requirements.


Qualifications

You should possess a Masters or Bachelors in Electrical Engineering/ Chemical Engineering/ Mechanical Engineering or Material Science. Additional qualifications include:- Solid background in semiconductor fabrication and packaging- Basic knowledge or experience of CAD tools used for Package and Board design- Experience and knowledge with assembly process, test and characterization techniques would be an added advantage.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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