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Job ID: JR0010414
Job Category: Intern/Student
Primary Location: Penang, PNG MY
Other Locations:
Job Type: Intern

Package R&D Design Engineer Graduate Trainee

Job Description

Packaging Engineers provide package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for integrating thermal/mechanical/electrical design requirements to development of electronic packages. Owns overall package design quality and realizes technology certification through layout design. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to stakeholder requests or events as they occur. Develops solutions to problems utilizing formal education and judgment. Develops best known method/drives innovative solutions for efficiency and through put time improvement.


Qualifications

Bachelor or Master degree in Electrical and/or Electronics Engineering preferably with CGPA 3 and above. Additional qualification includes but not limited to: - strong technical knowledge of electrical field theories and electronic fundamentals. - high level understanding of microprocessors and associated manufacturing technologies. - exposure to Package/Board CAD layout tool mentor/cadence will be added advantage. - the applicant should also have excellent communication written and presentation and problem solving skills.

Inside this Business Group

The Client Computing Group is responsible for all aspects of the client computing business across Phone, Phablet, Tablet and PC platforms, leading Intel's efforts to transform client computing through technologies, new form factors, and driving Intel's corporate-wide user experience initiatives. This spans all client device brands including hardware, software and connectivity ingredients for phones, tablets, Ultrabook™, All-in-Ones, 2 in 1 computing devices, and home gateways.

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