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F68 Thin Film/Planar Process EngineerJob Description: Fab68 TF/Planar department is looking for motivated and experienced Process Engineer who is capable of ramping and sustaining advanced Intel technology, in a 300mm 3D NAND factory located in Dalian, China. Applying to this posting will allow you to be considered for multiple local engineering positions available at this time.Responsibilities:Transferring process technology to HVM site.Module ownership and tool qualification. Includes: understanding process capability, process and hardware interaction, performing PM, leading troubleshooting activities, tracking tool and process performance, and driving defect reduction. Interacting with cross functional organizations to drive and prioritize improvement projects in safety, yield, cost, and manufacturability.Working and leading manufacturing equipment teams to develop inventive solutions to improve execution and efficiency in a high-volume manufacturing environmentFunctional areas:CVD, PVD, CMP, and Thin Film Metrology. Qualifications:Successful candidates must have demonstrated proficiencies in skills listed below. BS/MS/PhD in physics, chemistry, electrical engineering, materials science, optics, or chemical engineering. Candidates with previous work experience in above fields is a plus. Excellent analytical and proven problem solving skills; Strong hands-on skills on hardware; strong logical thinking of technical issues. Good understanding of factory and/or fabrication operations. A strong understanding of manufacturing science and systems, and engineering applications. Good work ethics with strong ownership and discipline. Excellent team player who can effectively listen, communicate, tolerate ambiguity, and commit to work. Ability to work in a culturally diverse environment.Fluency in Mandarin and good command of English.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.