Apply Now    
Job ID: JR0001914
Job Category: Intern/Student
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: Intern

Manufacturing TD Intern

Job Description
The role entails process and equipment development to 1) certify Intel next gen packaging solutions and 2) assemble prototypes of next generation Intel products. Defines and establishes flow, procedures, and equipment configuration for the printed circuit board assembly manufacturing module. Selects and develops material, tooling, fixtures, and equipment for the process to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Works with product engineers and the new package platform owners to plan and conduct experiments to fully characterize the process throughout the development cycle. Drives improvements on yield, process stability/capability, productivity and safety/ergonomic over variables such as material, method, equipment, environment and operating personnel. Develops solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools. Establishes process control systems such as SPC methods for the manufacturing module. Trains production and partner site process engineers for transfer to other factories.


Qualifications

This intern candidate must be pursuing a degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Material Science, or related discipline (Masters of Science or PhD degree preferred). Engineering work experience in manufacturing and/or circuit board assembling technology development (TD) is desired. The ideal candidate will have an understanding of surface mount technologies to assemble printed circuit boards, which utilizes processes related to solder paste screen printing, component placement, SMT reflow, wave solder and test. The role requires use of FMEA, SPC, statistical methods, and data analysis methods. The candidate must have strong communication, teamwork, problem solving and detail orientation skills. Additional qualifications include: - Ability to work across multi culture and/or multi geography - Strong interpersonal skills - Technical leadership and problem solving skills - Excellent communication skills

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
Apply Now    

What would you like to do now?

Connect with Us

Get Job Alerts

Get started
Student Center

Find out more about working at Intel

Learn more
Hiring Process

Hiring Process

Learn more

Grow your network of opportunities