Responsible for preparing ultra-thin specimen for transmission electron microscopy analysis in the process development characterization lab. Requires use of complex dual beam FIB, including some equipment alignment and testing. Continuous upgrading of skillset requires open attitude and ability to learn from others. Some degree of judgement required in resolving non-standard problems. Work is completed according to general (non-specific) instructions and prioritization. Maintains necessary records and reports, performs other related duties as required or as directed.
Inside this Business Group
Applicant must have FIB and/or SEM experience. Ideal candidate would have TEM sample preparation experience using dual beam FIB lift-out techniques. Successful applicant must be able to work in a close team environment and be able to both give and take directions from colleagues. Applicant must be able to work productively under pressure without making errors. Strict attention to details over entire compressed work week shift is required. This is a compressed day shift position that includes one weekend day (Saturday or Sunday)
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth