Stress Development QRE Graduate Trainee

Job Description
Responsible for deploying collateral and readiness for testability and manufacturability of IC (integrated circuit) from development stage into HVM (High Volume Manufacturing) factory and ready for production ramp (PRQ). Drives HVM product (IC) meet or exceed PHI (Product Health Indicator) to meet volume ramp requirement. Monitor HVM product manufacturing efficiency is consistently meeting preset goal. In case of deficit, perform first cut issue debug/analysis including commonality analysis, validating production test hardware/software, etc, and summarize issue for escalating to rightful/ultimate owner for solution. Track solution development progress according to committed deadline and own solution deployment to HVM operation. Responsible for continuous manufacturing efficiency trend monitoring, identify improvement opportunity with first cut ROI study before develop and deploy the improvement proposal, or submitting the improvement project to rightful/ultimate owner. Responsible for the optimization of HVM product production relative to both quality and cost constraints. Plan and schedule daily tasks, develop solutions to problems utilizing formal education and judgment based on standard practices.

Qualifications

Qualification - Master's Degree and/or Bachelor's Degree in Electronics, Electrical, Microelectronics, Science or a related technical degree General knowledge, personal skill, and working experience to be considered as hiring advantage:Working experience in semiconductor industrial, possess semiconductor HVM manufacturing process flow knowledgePossess statistical data analysis and data system automation skillsPossess strong teamwork, communication, problem-solving and influencing skillsFun and cheerful personality with strong learning desires1 year+ experience in Python(or other modern programming language) is a plus.Knowledgeable in class and Burn In test program development is a plus.

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.